AMD BC-250 Modular Cooling Enclosure

This is a simple, utility-focused enclosure for the AMD BC-250, designed with printability and function in mind rather than aesthetics. The case is broken down into separate panels to ensure a support-free printing process and compatibility with most standard 3D printers (minimum bed size 200mm x 200mm). Key Features & Assembly: Cooling: Designed for standard 40mm x 40mm fans. Modular Design: Each side is printed individually. The main body panels should be permanently bonded using glue, while the top cover is designed to be removable. Secure Fastening: The top cover utilizes threaded heat-set inserts for a durable, professional fit that allows for repeated opening and closing. Airflow Optimization: To ensure maximum cooling efficiency, it is highly recommended to apply soft sponge or foam tape around the BC-250 during installation. This creates a tight seal, preventing air bypass and ensuring all intake air is forced through the card's heatsink. Pro-Tip for your Build: When gluing the panels, using a jig or a square block will help ensure the case stays perfectly rectangular, which makes fitting that top cover much easier later on!